Ground via clustering for crosstalk mitigation

ABSTRACT

Embodiments of the present disclosure are directed towards techniques and configurations for ground via clustering for crosstalk mitigation in integrated circuit (IC) assemblies. In some embodiments, an IC package assembly may include a first package substrate configured to route input/output (I/O) signals and ground between a die and a second package substrate. The first package substrate may include a plurality of contacts disposed on one side of the first package substrate and at least two ground vias of a same layer of vias, and the at least two ground vias may form a cluster of ground vias electrically coupled with an individual contact. Other embodiments may be described and/or claimed.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/026,824 filed Jul. 3, 2018, which is a continuation of U.S. patentapplication Ser. No. 15/369,659 filed Dec. 5, 2016, now U.S. Pat. No.10,026,682, issued Jul. 17, 2018, which is a continuation of U.S. patentapplication Ser. No. 14/943,880 filed Nov. 17, 2015, now U.S. Pat. No.9,515,017, issued Dec. 6, 2016, which is a continuation of U.S. patentapplication Ser. No. 14/575,956, filed Dec. 18, 2014, now U.S. Pat. No.9,230,900, issued Jan. 5, 2016, all of which are entitled “GROUND VIACLUSTERING FOR CROSSTALK MITIGATION,” and which are herein incorporatedby reference in their entirety.

FIELD

Embodiments of the present disclosure generally relate to the field ofintegrated circuits, and more particularly, to techniques andconfigurations for ground via clustering for crosstalk mitigation inintegrated circuit assemblies.

BACKGROUND

High-speed signal-ended buses are widely used for both on-package andoff-package lines of communication to address high bandwidth demands ofintegrated circuit (IC) packages. However, crosstalk, especially that ofthe vertical interconnects, may limit the data rate that thesehigh-speed signal-ended buses are able to achieve and, therefore, maypose a challenge in meeting signaling performance targets. Additionalpins may be utilized for ground connections so that more verticalinterconnects are available to be assigned as grounds in an effort toisolate signals from each other and hence lower crosstalk betweensignals. However, these additional pins may increase the package formfactor and may increase the cost of manufacturing.

The background description provided herein is for generally presentingthe context of the disclosure. Unless otherwise indicated herein, thematerials described in this section are not prior art to the claims inthis application and are not admitted to be prior art or suggestions ofthe prior art by inclusion in this section.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. To facilitatethis description, like reference numerals designate like structuralelements. Embodiments are illustrated by way of example and not by wayof limitation in the figures of the accompanying drawings.

FIG. 1 schematically illustrates a cross-section side view of an exampleintegrated circuit (IC) assembly with ground via clustering, and twothree-dimensional (3D) models of interconnects with ground viaclustering in one package substrate of the example IC assembly, inaccordance with some embodiments.

FIG. 2 schematically illustrates a top view and a cross-section sideview of example two-via clustering patterns, in accordance with someembodiments.

FIG. 3 schematically illustrates a top view of example three-viaclustering patterns, in accordance with some embodiments.

FIG. 4 schematically illustrates a flow diagram of an example process offorming ground via clustering for crosstalk mitigation in IC assemblies,in accordance with some embodiments.

FIG. 5 schematically illustrates a computing device including ground viaclustering for crosstalk mitigation described herein, in accordance withsome embodiments.

DETAILED DESCRIPTION

Embodiments of the present disclosure describe techniques andconfigurations associated with ground via clustering for crosstalkmitigation in integrated circuit (IC) assemblies. For example,techniques described herein may be used to fabricate a package substratehaving vertical interconnects with clusters of ground vias. In thefollowing description, various aspects of the illustrativeimplementations will be described using terms commonly employed by thoseskilled in the art to convey the substance of their work to othersskilled in the art. However, it will be apparent to those skilled in theart that embodiments of the present disclosure may be practiced withonly some of the described aspects. For purposes of explanation,specific numbers, materials, and configurations are set forth in orderto provide a thorough understanding of the illustrative implementations.However, it will be apparent to one skilled in the art that embodimentsof the present disclosure may be practiced without the specific details.In other instances, well-known features are omitted or simplified inorder not to obscure the illustrative implementations.

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, wherein like numeralsdesignate like parts throughout, and in which is shown by way ofillustration embodiments in which the subject matter of the presentdisclosure may be practiced. It is to be understood that otherembodiments may be utilized and structural or logical changes may bemade without departing from the scope of the present disclosure.Therefore, the following detailed description is not to be taken in alimiting sense, and the scope of embodiments is defined by the appendedclaims and their equivalents.

For the purposes of the present disclosure, the phrase “A and/or B”means (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B, and C).

The description may use perspective-based descriptions such astop/bottom, in/out, over/under, and the like. Such descriptions aremerely used to facilitate the discussion and are not intended torestrict the application of embodiments described herein to anyparticular orientation.

The description may use the phrases “in an embodiment,” “inembodiments,” or “in some embodiments,” which may each refer to one ormore of the same or different embodiments. Furthermore, the terms“comprising,” “including,” “having,” and the like, as used with respectto embodiments of the present disclosure, are synonymous.

The term “coupled with,” along with its derivatives, may be used herein.“Coupled” may mean one or more of the following. “Coupled” may mean thattwo or more elements are in direct physical or electrical contact.However, “coupled” may also mean that two or more elements indirectlycontact each other, but yet still cooperate or interact with each other,and may mean that one or more other elements are coupled or connectedbetween the elements that are said to be coupled with each other. Theterm “directly coupled” may mean that two or more elements are in directcontact.

In various embodiments, the phrase “a first feature formed, deposited,or otherwise disposed on a second feature” may mean that the firstfeature is formed, deposited, or disposed over the second feature, andat least a part of the first feature may be in direct contact (e.g.,direct physical and/or electrical contact) or indirect contact (e.g.,having one or more other features between the first feature and thesecond feature) with at least a part of the second feature.

As used herein, the term “module” may refer to, be part of, or includean Application Specific Integrated Circuit (ASIC), an electroniccircuit, a system-on-chip (SoC), a processor (shared, dedicated, orgroup), and/or memory (shared, dedicated, or group) that execute one ormore software or firmware programs, a combinational logic circuit,and/or other suitable components that provide the describedfunctionality. The term “processor” may refer to any device or portionof a device that processes electronic data from registers and/or memoryto transform that electronic data into other electronic data that may bestored in registers and/or memory.

FIG. 1 schematically illustrates a cross-section side view of an exampleIC assembly 100 including package substrates 112 and 122 having verticalinterconnects with clusters of ground vias, in accordance with someembodiments.

As used herein, first level interconnect (FLI) may refer to aninterconnect between a die (e.g., die 110 or 120) and a packagesubstrate (e.g., package substrate 112 or 122), while second levelinterconnect (SLI) may refer to the interconnect between the packagesubstrate (e.g., package substrate 112 or 122) and another packagesubstrate (e.g., interposer 140) or circuit board. In embodiments, ICassembly 100 may include one or more dies (e.g., dies 110 and 120). Dies110 and 120 may be electrically and/or physically coupled with packagesubstrates 112 and 122, respectively, via one or more FLI structures.Package substrates 112 and 122 may further be electrically coupled withinterposer 140 via one or more SLI structures.

Either or both of dies 110 and 120 may represent a discrete unit madefrom a semiconductor material using semiconductor fabrication techniquessuch as thin film deposition, lithography, etching, and the like. Insome embodiments, either or both of dies 110 and 120 may include or be apart of a processor, memory, switch, ASIC, or SoC. Dies 110 and 120 maybe electrically and/or physically coupled with package substrates 112and 122, respectively, according to a variety of suitableconfigurations, including a flip-chip configuration, as depicted, orother configurations such as, for example, being embedded in the packagesubstrate.

In the flip-chip configuration, die 110 may be coupled with surface 132of package substrate 112 using FLI structures such as the interconnectstructures depicted. These interconnect structures may be configured toelectrically and/or physically couple die 110 with the package substrate112. In various embodiments, these interconnect structures may beelectrically coupled with electrical routing features of interposer 140configured to route electrical signals between die 110 and die 120, orbetween die 110 and any other electrical components. Similarly, die 120may be coupled with a surface 136 of package substrate 122 using FLIstructures such as the interconnect structures depicted. Theseinterconnect structures may be configured to electrically and/orphysically couple die 120 with the package substrate 122. Inembodiments, these interconnect structures may be electrically coupledwith electrical routing features of interposer 140 configured to routeelectrical signals between die 120 and die 110, or between die 120 andany other electrical components. In some embodiments, the electricalsignals may include input/output (I/O) signals and/or power/groundassociated with operation of the dies 110 and/or 120.

In some embodiments, various components in FIG. 1 may form apackage-level high-speed single-ended channel. In such embodiments,package substrate 112 may be a stacked via laminate core (SVLC) packagesubstrate, and package substrate 122 may be a standard core packagesubstrate. In some embodiments, die 110 may be a processor, and die 120may be another processor, a memory device, or a field-programmable gatearray (FPGA) device such as a network switch. As depicted, die 110 maybe coupled with the SVLC package substrate while die 120 may be coupledwith the standard core package substrate. Both the SVLC packagesubstrate and the standard core package substrate may then be coupledwith another package substrate (e.g., interposer 140), via, for example,ball grid array (BGA) interconnect structures (e.g., solder balls 114 or124) to complete the high-speed single-ended channel.

It will be appreciated that the BGA interconnect structures depicted bysolder balls 114 or 124 are merely meant to be example interconnectstructures for the sake of discussion. In other embodiments, land-gridarray (LGA) structures may electrically couple one or more lands onpackage substrate 112 with one or more pads on interposer 140, which mayroute electrical signals between package substrate 112 and interposer140. It will be appreciated that the above discussed examples are meantto be illustrative and that any of a variety of suitable interconnectstructures and/or layers may be utilized to electrically couple dies 110and 120 or other dies (not shown) with the interposer 140. It will beappreciated that various embodiments may additionally include otherinterconnect structures, such as, for example, trenches, vias, traces,or conductive layers, and the like that may be utilized to implement ahigh-speed single-ended channel to route electrical signals between die110 and die 120.

The vertical interconnects in package substrate 112 may be schematicallyillustrated by the 3D model 150. In one embodiment, the verticalinterconnect 116 may correspond to three vertical interconnectsub-components 152, 154, and 156. In various embodiments, the threevertical interconnect sub-components 152, 154, and 156 may be used toroute a ground between package substrate 112 and interposer 140, e.g.,through surface 134. Further, in some embodiments, the three verticalinterconnect sub-components 152, 154, and 156 may be surrounded byseveral vertical interconnects (e.g., interconnect 158) that may routeinput/output (I/O) signals between package substrate 112 and interposer140. In some embodiments, the vertical interconnects depicted in 3Dmodel 150 may form a 2:1 signal-to-ground ratio.

Similarly, the vertical interconnects in package substrate 122 may beschematically illustrated by the 3D model 160. In one embodiment, thevertical interconnect 126 may correspond to three vertical interconnectsub-components 162, 164, and 166. In various embodiments, the threevertical interconnect sub-components 162, 164, and 166 may be used toroute a ground between package substrate 122 and interposer 140, e.g.,through surface 138. Further, in some embodiments, the three verticalinterconnect sub-components 162, 164, and 166 may be surrounded byseveral vertical interconnects (e.g., interconnect 168) that may routeinput/output (I/O) signals between package substrate 122 and interposer140. In some embodiments, the vertical interconnects depicted in 3Dmodel 160 may also form a 2:1 signal-to-ground ratio.

In various embodiments, the three vertical interconnect sub-components152, 154, and 156 may form at least one ground via cluster. Similarly,the three vertical interconnect sub-components 162, 164, and 166 mayalso form at least one ground via cluster. 3D model 150 and 3D model 160reflects the effect of ground via clustering. In some embodiments, theextra ground interconnect sub-components (e.g., 154 and 156) may be onlyapplied to the outermost column of ground interconnects, or the columnof ground interconnects that are closest to a signal source (e.g.,vertical interconnects 116 and 126). Such an embodiment, may bebeneficial because the first two columns of interconnects maydemonstrate more crosstalk between the signals carried by theseinterconnects than those of inner columns. In other embodiments, theextra ground interconnect sub-components (e.g., 164 and 166) may also beapplied to other inner ground columns.

Crosstalk of the single-ended signaling may be highly sensitive to theground reference design in the vertical interconnects. For example, whenthe coupling between a first signal and an associated ground getsstronger, the mutual coupling between the first signal and a secondsignal may become weaker. As a result, the crosstalk may be mitigatedbetween these two signals by increasing the strength of the couplingbetween these two signals and the respective grounds associated withthese two signals. As such, adding more interconnect structures (e.g.,BGA connections) and assigning them to ground may produce bettersignal-to-signal isolation. For example, changing to a conservative 1:1signal-to-ground ratio from a 2:1 signal-to-ground ratio may helpmitigate the signaling risk, but such a configuration would requireadditional 80 ground balls for a 2×40 interface, which wouldconsequentially increase the cost and the size of the package formfactor.

In various embodiments, the ground via clustering design, as shown in 3Dmodel 150 and 3D model 160, would eliminate or reduce the increase insize of the package form factor discussed above. As such, clusteringground vias adjacent to each other, as shown in 3D model 150 and 3Dmodel 160, may increase the size of ground and, as a result, may boostthe coupling between a signal and an associated ground withoutincreasing the corresponding footprint. Thus, the ground via clusteringmay be implemented with existing substrate design rules and withoutimpacting the rest of the package design.

In various embodiments, ground via clustering may reduce both far-endand the near-end crosstalk. Thus, ground via clustering may beimplemented in both terminated and un-terminated high-speed single-endedchannels. In some instances, ground via clustering may reduce crosstalkby 50% or more. Moreover, the ground via clustering design may alsoimprove signal-to-noise ratio (SNR) of the signal. Thus, channelsignaling risk may be reduced without a corresponding increase in a sizeof the package form factor.

FIG. 2 schematically illustrates a top view 200 and a cross-section sideview 290 of example two-via clustering patterns, in accordance with someembodiments. Three-via clustering patterns or ground via clusteringpatterns with more than three ground vias may also be used in otherembodiments. In various embodiments, a cluster of ground vias instead ofa single ground via may be used to mitigate or reduce the crosstalkwithout the need for any additional interconnect structures between twopackage substrates.

In some embodiments, such as that depicted, the cluster of ground viasmay be surrounded by signal vias, of a same layer (e.g., layer 296), ina hexagonal pattern. For example, one cluster of ground vias (e.g.,ground vias 212 and 214) may be surrounded by six signal vias (e.g.,signal via 222) having respective ball pad 220 in a hexagonalarrangement. In other embodiments, other patterns, e.g., four signalvias disposed in a square arrangement around a cluster of ground vias,may also be used without departing from the scope of this disclosure.

In some embodiments, the two ground vias may be formed substantiallyapart from each other, but may still contact the same underlying contactstructure (e.g., ball pad). For example, as depicted, ground vias 212and 214 are formed apart from each other, but still contact the sameball pad 210.

Cross-section side view 290 schematically illustrates an example two-viaclustering pattern. Package substrate 230 may have one side (e.g., side282) to receive a die and another side (e.g., side 284) to be coupledwith another package substrate or circuit board. In various embodiments,vertical interconnect structures (e.g., vertical interconnect structures232, 240, and 250) may be disposed in package substrate 230. Verticalinterconnect structures may electrically couple structures such as, forexample, traces, trenches, vias, lands, pads or other structures thatmay establish corresponding electrical pathways for electrical signalsthrough package substrate 230.

In some embodiments, e.g., for implementation in server products,vertical interconnect structures may be longer than 1 millimeter (mm),including stacks of micro-vias and core vias, and a solder ball. A corevia may be an opening through the core substrate filled with conductingmaterial that may be used to connect routing features, e.g., a metalpad, placed on one face of the substrate core with routing features,e.g., another metal pad, placed on the opposite face of the substratecore. In various embodiments, a core via may be much bigger than amicro-via as the core layer may be much thicker than build-up layers inan organic package. In such embodiments, vertical interconnect structure232 may include stacks of vias disposed on ball pad 262, which in turnmay have solder ball 272 disposed thereon. Vertical interconnectstructure 232 may be used to route signals through package substrate230.

As depicted, in some embodiments, vertical interconnect structure 240may include stacks of vias (e.g., via 242, via 244, and via 246)disposed on ball pad 264, which in turn may have solder ball 274disposed thereon. Vertical interconnect structure 240 may be used toroute a ground through package substrate 230. Similarly, verticalinterconnect structure 250 may include stacks of vias (e.g., via 252,via 254, and via 256) disposed on a same ball pad 264, which in turn mayhave solder ball 274 disposed thereon. Vertical interconnect structure250 may also be used to route a ground through package substrate 230.

In some embodiments, package substrate 230 may be an epoxy-basedlaminate substrate having build-up layers such as, for example, anAjinomoto Build-up Film (ABF) substrate. In various embodiments, packagesubstrate 230 may include other suitable types of substrates including,for example, substrates formed from glass, ceramic, or semiconductormaterials. In various embodiments, via 242 and via 252 may be formed inthe same substrate layer 292, while via 244 and via 254 may be formed inthe same substrate layer 294. Similarly, via 246 and via 256 may beformed in the same substrate layer 296. In some embodiments, via 246 andvia 256 may be core vias in a core layer. Thus, Via 242 and via 252 mayform a ground via cluster in layer 292, while via 244 and via 254 mayform another ground via cluster in layer 294. Similarly, via 246 and via256 may form yet another ground via cluster in layer 296.

In various embodiments, via 242 and via 252 may be formed in layer 292in any conventional manner known in the art. For example, an opening maybe formed over pad 264 by drilling in a region of dielectric materialdisposed over pad 264, using a technique, such as employing CO₂ or a UVlaser. In embodiments, any conventional plating operations may be usedto deposit electrically conductive material into the openings to formvias. In some embodiments, electrolytic plating operations may be usedto deposit the electrically conductive material into the drilledopenings, and chemical, mechanical polishing (CMP) or copper (Cu)etching operations may be used after depositing the electricallyconductive material to remove any excess electrically conductivematerial. In various embodiments, via 246 and via 256 may be formed inlayer 296 with similar or different manners known in the art.

In various embodiments, layer 292, layer 294, or layer 296 may be adielectric layer composed of any of a wide variety of suitabledielectric materials including, for example, epoxy-based laminatematerial, silicon oxide (SiO₂), silicon carbide (SiC), siliconcarbonitride (SiCN), or a silicon nitride (e.g., SiN, Si₃N₄, etc.). Inembodiments, layer 292 or layer 294 may include a polymer (e.g.,epoxy-based resin) and may further include a filler (e.g., silica) toprovide suitable mechanical properties to meet reliability standards ofthe resulting package. In embodiments, layer 292, layer 294, or layer296 may be formed as a film of polymer, such as by ABF lamination. Inembodiments, layer 292, layer 294, or layer 296 may be formed bydepositing a dielectric material using any suitable technique including,for example, atomic layer deposition (ALD), physical vapor deposition(PVD) or chemical vapor deposition (CVD) techniques.

In embodiments, substrate 230 may include multiple routing features,such as pad 262 or pad 264, configured to advance the electricalpathways within or through the substrate. In various embodiments, pad262 or pad 264 may be composed of any suitable electrically conductivematerial such as metal including, for example, nickel (Ni), palladium(Pd), gold (Au), silver (Ag), copper (Cu), or any combinations thereof.In some embodiments, pad 262 or pad 264 may be formed using a patternedmetal layer configured to: electrically couple pad 262 with verticalinterconnect structure 232 to route electrical signals through thepackage substrate 230; or electrically couple pad 264 with verticalinterconnect structures 240 and 250 to route a ground through thepackage substrate 230. The patterned metal layer may be formed in anyconventional manner known in the art. For example, the patterned metallayer may be an inner or outermost conductive layer of a build-up layerformed with a semi-additive process (SAP).

FIG. 3 schematically illustrates a top view of example three-viaclustering patterns, in accordance with some embodiments. In someembodiments, examples of using three-via clustering may be used in ahexagonal arrangement. For example, a cluster of ground vias may besurrounded by signal vias, of the same layer of vias, disposed in ahexagonal pattern, i.e., one cluster of ground vias surrounded by sixsignal vias. As illustrated in FIG. 3, the cluster of ground vias 322,324, and 326 are surrounded by signal vias including signal via 332 in ahexagonal arrangement. Similarly, the cluster of ground vias 352, 354,and 356 may also be surrounded by signal vias in a similar hexagonalarrangement. In other embodiments, other patterns, e.g., four signalvias disposed in a square arrangement around a cluster of ground vias,may also be used to arrange signals vias surrounding the cluster ofground vias without departing from the scope of the present disclosure.

As discussed in reference to FIG. 1, above, ground via clustering may beused for the SVLC package substrates and standard core packagesubstrates. The SVLC package substrates and the standard core packagesubstrates may have to comport with various different design rules anddifferent ball pitches. However, as depicted, two ground vias may besuccessfully added to form the three-via cluster without violating theseexisting design rules. For example, vertical interconnect structurestacks of micro-vias and core-vias may be formed adjacent to originalground vias in an existing design, and, as a result, may maintain theform factor of the design.

In some embodiments, the cluster of ground vias may be in a triangulararrangement. As an example, ground vias 322, 324, and 326 are depictedin a triangular arrangement. Similarly, ground vias 352, 354, and 356are depicted in another triangular arrangement. In some embodiments, oneground via may be disposed over the center of the underlying contact(e.g., a ball pad), and the other two ground vias may be added to a sideof the underlying contact. For example, among the cluster of ground vias322, 324, and 326, via 322 is placed at the center of ball pad 320, in asimilar manner to ground via 342 and its associated ball pad. However,ground vias 324 and 326 may be added to ground via 322 to form theground via cluster in a triangular arrangement. In some embodiments, thecenter of the triangular arrangement of ground vias may be disposed overthe center of the underlying contact. For example, ground vias 352, 354,and 356 form a triangular arrangement, and the center of the clusteroverlaps with the center of ball pad 350.

In various embodiments, two or more ground vias may be arranged invarious cluster designs. For example, the number of ground vias to beclustered may be more than three depending on the design space or otherdesign constraints. In some embodiments, the ground via cluster may beplaced closer to certain signals as an emphasis. As an example, thearrangement of ground vias 322, 324, and 326 has more emphasis onsignals near edge 310 because those signals generally demonstrategreater inclination for crosstalk. In some embodiments, the ground viacluster may be centered, as shown in the arrangement of ground vias 352,354, and 356, which may provide an equal improvement on all thesurrounding signals. In various embodiments, ground via clustering, asshown in FIG. 3, may reduce far-end crosstalk (FEXT) and near-endcrosstalk (NEXT). Consequently, the signal-to-noise ratio (SNR) may beimproved for the channel.

FIG. 4 schematically illustrates a flow diagram of an example process400 of forming a ground via cluster for crosstalk mitigation in ICassemblies (e.g., IC assembly 100 of FIG. 1), in accordance with someembodiments. The process 400 may comport with embodiments described inconnection with previous figures according to various embodiments.

At block 410, the process 400 may include forming a plurality ofelectrical contacts on one side of a first package substrate configuredto route input/output (I/O) signals and ground between a die and asecond package substrate. In various embodiments, the contacts on theside of the first package substrate may include ball pads. In someembodiments, ball pads may be solder mask defined (SMD). In otherembodiments, ball pads may be non-solder mask defined (NSMD). In someembodiments, forming contacts on one side of the package substrate maybe realized by embedding the contacts (e.g., pads) in build-up layers(e.g., the outermost build-up layer) as part of the formation of thebuild-up layers. In some embodiments, forming contacts on one side ofthe package substrate may be realized by forming openings in thebuild-up layers and disposing the contacts (e.g., pads) into thecavities subsequent to formation of the build-up layers, according toany suitable technique.

At block 420, the process 400 may include forming a cluster of groundvias with at least two ground vias, of a same layer of vias, toelectrically couple with an individual contact of the plurality ofcontacts. Block 420 may be performed during the fabrication process of apackage substrate according to various embodiments, e.g., during thefabrication of various layers of package substrate 230, such as layer292 or layer 294. In various embodiments, forming the cluster of groundvias may include forming the cluster of ground vias in a column ofground vias closest to an edge of the package substrate, such as thefirst column of ground vias. The first two columns of signals maydemonstrate a higher susceptibility to crosstalk than the inner columns;thus, forming the cluster of ground vias in a column of ground viasclosest to an edge of the package substrate may mitigate such crosstalk.In some embodiments, block 420 may be performed only to the column ofground vias closest to the edge, which may yield a cost-effectivesolution in reducing such crosstalk.

In various embodiments, forming the cluster of ground vias may includeforming a vertical interconnect structures including the cluster ofground vias between two sides of the first package substrate, e.g., thevertical interconnect structures 240 and 250 in FIG. 2 formed betweenside 282 and side 284 of package substrate 230. In some embodiments,forming the cluster of ground vias may include forming the cluster ofground vias in an outermost layer of vias adjacent to the side, e.g.,via 242 and via 252 in FIG. 2 as a part of the outermost layer of viasin layer 292. In some embodiments, forming the cluster of ground viasmay include forming the cluster of ground vias in a second layer of viasdirectly adjacent to the outermost layer of vias, e.g., as via 244 andvia 254 in layer 294 in FIG. 2. In some embodiments, forming the clusterof ground vias may include forming the cluster of core vias in a samelayer of vias, e.g., as via 246 and via 256 in layer 296 in FIG. 2.

In some embodiments, forming the cluster of ground vias may includeforming two ground vias apart from each other. As illustrated in FIG. 2,the cluster of ground vias 212 and 214 may be formed apart from eachother, but still in contact with the same ball pad 210. In someembodiments, forming the cluster of ground vias may include formingthree ground vias in a triangular arrangement. In such embodiments, thecenter of the triangular arrangement of ground vias may be disposed overa center of the ball pad. As illustrated in FIG. 3, ground vias 352,354, and 356 may form a triangular arrangement, and the center of thecluster may overlap with the center of ball pad 350. In variousembodiments, forming the cluster of ground vias may include forming thecluster of ground vias surrounded by signal vias of the same layer ofvias. As illustrated in FIG. 3, the cluster of ground vias 322, 324, and326 may be surrounded by signal vias including signal via 332 in ahexagonal arrangement.

At block 430, the process 400 may include forming an individual solderjoint on an individual contact to electrically couple the first packagesubstrate to the second package substrate or circuit board. In variousembodiments, the individual contact on the first package substrate maybe a ball pad, which may correspond to a counterpart contact on thesecond package substrate, such as a solder pad. A solder ball may thenbe used to couple the ball pad with the solder pad, e.g., in a BGAconfiguration, to form a corresponding solder joint that may beconfigured to further route the electrical signals between the first andsecond package substrates. In other embodiments, individual solder jointmay be formed as other types of package interconnects, such as land-gridarray (LGA) structures or other suitable structures.

Various operations are described as multiple discrete operations inturn, in a manner that is most helpful in understanding the claimedsubject matter. However, the order of description should not beconstrued as to imply that these operations are necessarily orderdependent. Operations of the process 400 may be performed in anothersuitable order than depicted.

Embodiments of the present disclosure may be implemented into a systemusing any suitable hardware and/or software to configure as desired.FIG. 5 schematically illustrates a computing device that includes groundvia clustering for crosstalk mitigation in integrated circuitassemblies, as described herein, in accordance with some embodiments.The computing device 500 may house a board such as motherboard 502.Motherboard 502 may include a number of components, including but notlimited to processor 504 and at least one communication chip 506.Processor 504 may be physically and electrically coupled to motherboard502. In some implementations, the at least one communication chip 506may also be physically and electrically coupled to motherboard 502. Infurther implementations, communication chip 506 may be part of processor504.

Depending on its applications, computing device 500 may include othercomponents that may or may not be physically and electrically coupled tomotherboard 502. These other components may include, but are not limitedto, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flashmemory, a graphics processor, a digital signal processor, a cryptoprocessor, a chipset, an antenna, a display, a touchscreen display, atouchscreen controller, a battery, an audio codec, a video codec, apower amplifier, a global positioning system (GPS) device, a compass, aGeiger counter, an accelerometer, a gyroscope, a speaker, a camera, anda mass storage device (such as hard disk drive, compact disk (CD),digital versatile disk (DVD), and so forth).

Communication chip 506 may enable wireless communications for thetransfer of data to and from computing device 500. The term “wireless”and its derivatives may be used to describe circuits, devices, systems,methods, techniques, communications channels, etc., that may communicatedata through the use of modulated electromagnetic radiation through anon-solid medium. The term does not imply that the associated devices donot contain any wires, although in some embodiments they might not.Communication chip 506 may implement any of a number of wirelessstandards or protocols, including but not limited to Institute forElectrical and Electronic Engineers (IEEE) standards including Wi-Fi(IEEE 802.11 family), IEEE 802.16 standards (e.g., IEEE 802.16-2005Amendment), Long-Term Evolution (LTE) project along with any amendments,updates, and/or revisions (e.g., advanced LTE project, ultra-mobilebroadband (UMB) project (also referred to as “3GPP2”), etc.). IEEE802.16 compatible BWA networks are generally referred to as WiMAXnetworks, an acronym that stands for Worldwide Interoperability forMicrowave Access, which is a certification mark for products that passconformity and interoperability tests for the IEEE 802.16 standards.Communication chip 506 may operate in accordance with a Global Systemfor Mobile Communication (GSM), General Packet Radio Service (GPRS),Universal Mobile Telecommunications System (UMTS), High Speed PacketAccess (HSPA), Evolved HSPA (E-HSPA), or LTE network. Communication chip506 may operate in accordance with Enhanced Data for GSM Evolution(EDGE), GSM EDGE Radio Access Network (GERAN), Universal TerrestrialRadio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN). Communicationchip 506 may operate in accordance with Code Division Multiple Access(CDMA), Time Division Multiple Access (TDMA), Digital Enhanced CordlessTelecommunications (DECT), Evolution-Data Optimized (EV-DO), derivativesthereof, as well as any other wireless protocols that are designated as3G, 4G, 5G, and beyond. Communication chip 506 may operate in accordancewith other wireless protocols in other embodiments.

Computing device 500 may include a plurality of communication chips 506.For instance, a first communication chip 506 may be dedicated to shorterrange wireless communications such as Wi-Fi and Bluetooth, and a secondcommunication chip 506 may be dedicated to longer range wirelesscommunications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, andothers.

Processor 504 of computing device 500 may be packaged in an IC assembly(e.g., IC assembly 100 of FIG. 1) that includes a substrate (e.g.,package substrate 112 of FIG. 1) with vertical interconnect structureshaving ground via clusters formed according to techniques as describedherein. For example, processor 504 may be die 110 coupled to packagesubstrate 112 using interconnect structures. The term “processor” mayrefer to any device or portion of a device that processes electronicdata from registers and/or memory to transform that electronic data intoother electronic data that may be stored in registers and/or memory.

Communication chip 506 may also include one or more dies that may bepackaged in an IC assembly (e.g., IC assembly 100 of FIG. 1) thatincludes a substrate (e.g., package substrate 112 of FIG. 1) withvertical interconnect structures having ground via clusters formedaccording to techniques as described herein.

In further implementations, another component (e.g., memory device orother integrated circuit device) housed within computing device 500 mayinclude one or more dies that may be packaged in an IC assembly (e.g.,IC assembly 100 of FIG. 1) that includes a substrate (e.g., packagesubstrate 122 of FIG. 1) with vertical interconnect structures havingground via clusters formed according to techniques as described herein.

According to some embodiments, multiple processor chips and/or memorychips may be disposed in an IC assembly including a package substratewith ground via clusters in vertical interconnect structures, which maybe a part of the channel to electrically route signals between any twoof the processor or memory chips.

In various implementations, computing device 500 may be a laptop, anetbook, a notebook, an Ultrabook™, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra-mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the computingdevice 500 may be any other electronic device that processes data.

Examples

According to various embodiments, the present disclosure describes anintegrated circuit (IC) package assembly. Example 1 of an IC packageassembly may include a first package substrate configured to routeinput/output (I/O) signals and ground between a die and a second packagesubstrate, the first package substrate having a first side configured toreceive the die and a second side opposite the first side. The firstpackage substrate may include a plurality of contacts disposed on thesecond side of the first package substrate; and at least two ground viasof a same layer of vias, wherein an individual contact of the pluralityof contacts is configured to form an individual solder joint with thesecond package substrate, and wherein the at least two ground vias forma cluster of ground vias electrically coupled with the individualcontact. Example 2 may include the subject matter of Example 1, whereinthe cluster of ground vias is part of a vertical interconnect betweenthe first side and the second side of the first package substrate.Example 3 may include the subject matter of Example 1 or 2, wherein thesame layer of vias is an outermost first layer of vias adjacent to thesecond side, a second layer of vias directly adjacent to the outermostfirst layer of vias, or a third layer of vias directly adjacent to thesecond layer of vias. Example 4 may include any subject matter ofExamples 1-3, wherein the cluster of ground vias is a part of a columnof ground vias closest to an edge of the first package substrate.Example 5 may include any subject matter of Examples 1-4, wherein thecluster of ground vias is surrounded by signal vias of the same layer ofvias. Example 6 may include the subject matter of Example 5, wherein thesignal vias are configured in a substantially hexagonal arrangementaround the cluster of ground vias. Example 7 may include any subjectmatter of Examples 1-6, wherein the cluster of ground vias includesthree ground vias in a triangular arrangement. Example 8 may include thesubject matter of Example 7, wherein a center of the triangulararrangement is disposed over a center of the individual contact. Example9 may include any subject matter of Examples 1-8, further include thesecond package substrate, wherein the second package substrate iscoupled with the first package substrate through the individual solderjoint. Example 10 may include any subject matter of Examples 1-9,wherein a distance between the at least two ground vias is less than adiameter of the individual contact. Example 11 may include any subjectmatter of Examples 1-10, wherein the at least two ground vias have asame diameter. Example 12 may include any subject matter of Examples1-11, wherein the individual solder joint is part of a ball grid array(BGA) configuration of solder joints. Example 13 may include any subjectmatter of Examples 1-12, wherein the first package substrate is astacked via laminate core package or a core BGA package.

According to various embodiments, the present disclosure describes amethod. Example 14 of a method may include forming a plurality ofcontacts on a side of a first package substrate configured to routeinput/output (I/O) signals and ground between a die and a second packagesubstrate; forming a cluster of ground vias with at least two groundvias of a same layer of vias to electrically couple with an individualcontact of the plurality of contacts; and forming an individual solderjoint on the individual contact to electrically couple the first packagesubstrate to the second package substrate. Example 15 may include themethod of Example 14, wherein forming the cluster of ground viascomprises forming a vertical interconnect including the cluster ofground vias between two sides of the first package substrate. Example 16may include the method of Example 14 or 15, wherein forming the clusterof ground vias comprises forming the cluster of core vias in the samelayer of vias. Example 17 may include any method of Examples 14-16,wherein forming the cluster of ground vias comprises forming the clusterof ground vias surrounded by signal vias of the same layer of vias.Example 18 may include any method of Examples 14-17, wherein forming thecluster of ground vias comprises forming three ground vias in atriangular arrangement. Example 19 may include the method of Example 18,wherein a center of the triangular arrangement is disposed over a centerof the individual contact. Example 20 may include any method of Examples14-19, wherein forming the cluster of ground vias comprises forming twoground vias apart from each other. Example 21 may include any method ofExamples 14-20, wherein forming the cluster of ground vias comprisesforming the cluster of ground vias in a column of ground vias closest toan edge of the first package substrate.

According to various embodiments, the present disclosure may describe apackage assembly. Example 22 of an package assembly may include a firstdie; a first package substrate, electrically coupled to the first dieand configured to route input/output (I/O) signals and ground betweenthe first die and a second package substrate, the first packagesubstrate having a first side configured to receive the die and a secondside opposite the first side, the first package substrate including aplurality of contacts disposed on the second side of the first packagesubstrate; and at least two ground vias of a same layer of vias, whereinan individual contact of the plurality of contacts is configured to forman individual solder joint with the second package substrate, andwherein the at least two ground vias form a cluster of ground viaselectrically coupled with the individual contact; the second packagesubstrate with an interconnect embedded in the second package substrateto electrically couple the first package substrate with a third packagesubstrate; and the third package substrate, electrically coupled to thesecond package substrate and a second die, configured to routeinput/output (I/O) signals and ground between the second die and thesecond package substrate. Example 23 may include the package assembly ofExample 21, wherein the first package substrate is a stacked vialaminate core package, wherein the second package substrate is aninterposer, and wherein the third package substrate is a core ball gridarray package. Example 24 may include the package assembly of Example 22or 23, wherein the first die is a CPU, and wherein the second die is aswitch. Example 25 may include any package assembly of Examples 22-24,wherein the cluster of ground vias is a part of a column of ground viasclosest to an edge of the first package substrate.

Various embodiments may include any suitable combination of theabove-described embodiments including alternative (or) embodiments ofembodiments that are described in conjunctive form (and) above (e.g.,the “and” may be “and/or”). Furthermore, some embodiments may includeone or more articles of manufacture (e.g., non-transitorycomputer-readable media) having instructions, stored thereon, that whenexecuted result in actions of any of the above-described embodiments.Moreover, some embodiments may include apparatuses or systems having anysuitable means for carrying out the various operations of theabove-described embodiments.

The above description of illustrated implementations, including what isdescribed in the Abstract, is not intended to be exhaustive or to limitthe embodiments of the present disclosure to the precise formsdisclosed. While specific implementations and examples are describedherein for illustrative purposes, various equivalent modifications arepossible within the scope of the present disclosure, as those skilled inthe relevant art will recognize.

These modifications may be made to embodiments of the present disclosurein light of the above detailed description. The terms used in thefollowing claims should not be construed to limit various embodiments ofthe present disclosure to the specific implementations disclosed in thespecification and the claims. Rather, the scope is to be determinedentirely by the following claims, which are to be construed inaccordance with established doctrines of claim interpretation.

What is claimed is:
 1. A semiconductor package, comprising: a packagesubstrate having a first side and a second side, the first side oppositethe second side, the package substrate comprising: ball pad on thesecond side of the package substrate; and a vertical interconnectbetween the first side and the second side of the package substrate, thevertical interconnect comprising a first ground conductive via laterallyadjacent to a second ground conductive via, wherein the first groundconductive via and the second ground conductive via are both in directcontact with the ball pad; a die coupled to the first side of thepackage substrate, the die having a footprint; and a solder ball coupledto the bond pad on the second side of the package substrate, the solderball outside of the footprint of the die.
 2. The semiconductor packageof claim 1, wherein the package substrate is a multi-layer packagesubstrate comprising one or more conductive layers, and wherein thefirst ground conductive via and the second ground conductive via arebetween the ball pad and one of the one or more conductive layers. 3.The semiconductor package of claim 2, wherein the one of the one or moreconductive layers is a layer immediately above the first groundconductive via and the second ground conductive via.
 4. Thesemiconductor package of claim 1, wherein the first ground conductivevia and the second ground conductive via extend fully between the firstside and the second of the package substrate.
 5. The semiconductorpackage of claim 1, the first ground conductive via and the secondground conductive are coupled to electrical routing in the packagesubstrate, the electrical routing coupled to the die.
 6. Thesemiconductor package of claim 1, further comprising a second dieelectrically coupled to the first die.
 7. The semiconductor package ofclaim 6, further comprising a second package substrate, the second dieattached to the second package substrate, and the second packagesubstrate electrically coupled to the first package substrate.
 8. Thesemiconductor package of claim 1, wherein the vertical interconnectfurther comprises a third ground conductive via laterally adjacent tothe first and second ground conductive vias, wherein the thirdconductive via is in direct contact with the ball pad.
 9. Thesemiconductor package of claim 8, wherein the vertical interconnectfurther comprises one or more additional ground conductive via laterallyadjacent to the first, second and third ground conductive vias, whereinthe one or more additional ground conductive vias are in direct contactwith the ball pad.
 10. The semiconductor package of claim 1, wherein theball pad comprises copper.
 11. A method of fabricating a semiconductorpackage, the method comprising: providing a package substrate having afirst side and a second side, the first side opposite the second side,the package substrate comprising: a ball pad on the second side of thepackage substrate; and a vertical interconnect between the first sideand the second side of the package substrate, the vertical interconnectcomprising a first ground conductive via laterally adjacent to a secondground conductive via, wherein the first ground conductive via and thesecond ground conductive via are both in direct contact with the ballpad; coupling a die coupled to the first side of the package substrate,the die having a footprint; and coupling a solder ball coupled to thebond pad on the second side of the package substrate, the solder balloutside of the footprint of the die.
 12. The method of claim 11, whereinthe package substrate is a multi-layer package substrate comprising oneor more conductive layers, and wherein the first ground conductive viaand the second ground conductive via are between the ball pad and one ofthe one or more conductive layers.
 13. The method of claim 12, whereinthe one of the one or more conductive layers is a layer immediatelyabove the first ground conductive via and the second ground conductivevia.
 14. The method of claim 11, wherein the first ground conductive viaand the second ground conductive via extend fully between the first sideand the second of the package substrate.
 15. The method of claim 11, thefirst ground conductive via and the second ground conductive are coupledto electrical routing in the package substrate, the electrical routingcoupled to the die.
 16. The method of claim 11, further comprisingelectrically coupling a second die to the first die.
 17. The method ofclaim 16, further comprising electrically coupling a second packagesubstrate to the first package substrate, wherein the second die isattached to the second package substrate.
 18. The method of claim 11,wherein the vertical interconnect further comprises a third groundconductive via laterally adjacent to the first and second groundconductive vias, wherein the third conductive via is in direct contactwith the ball pad.
 19. The method of claim 18, wherein the verticalinterconnect further comprises one or more additional ground conductivevia laterally adjacent to the first, second and third ground conductivevias, wherein the one or more additional ground conductive vias are indirect contact with the ball pad.
 20. The method of claim 11, whereinthe ball pad comprises copper.